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Gallium Indium Tin alloy


Gallium Indium Tin Alloy - Galinstan is a liquid metal alloy whose composition is taken from a family of eutectic alloys mainly consisting of gallium, indium, and tin. Such eutectic alloys are liquids at room temperature, typically melting at −19 °C (−2 °F). Due to the low toxicity and low reactivity of its component metals, galinstan finds use as a replacement for many applications that previously employed toxic liquid mercury or reactive NaK (sodium-potassium alloy). An example of a typical eutectic composition is 68.5 wt% Ga, 21.5 wt% In and 10 wt% Sn, though it varies between 62 wt% to 95 wt% Ga, 5 wt% to 22 wt% In, 0 wt% to 16 wt% Sn while keeping eutectic ability. The marketing name is a portmanteau of gallium, indium, and stannum (Latin for "tin"). Galinstan is a registered trademark of the German company Geratherm Medical AG. The exact composition of Galinstan is not publicly known.

Santech Materials specializes in producing Galinstan with typical proportion (Ga 68.5%, In 21.5%, Sn 10%), or GaIn, InSn, GaSn as required. Copper Indium Gallium Selenide (CIGS) can be customized.

Element Gallium Indium Tin GaInSn (Typical Ratio)
Resistivity at 20 °C: 270 nΩ·m at 20 °C: 83.7 nΩ·m at 0 °C: 115 nΩ·m at 20 °C:0.289 nΩ·m
Thermal Conductivity 40.6 W·m−1·K−1 81.8 W·m−1·K−1 66.8 W·m−1·K−1 31.0 W·m−1·K−1
Melting Point 29.78 °C 156.61°C 231.93 °C 6 °C
Boiling Point 2403 °C 2072 °C 2602 °C >1300 °C
Density at 20 °C:5.91 g·cm−3
Liquid State:6.095g·cm−3
at 20 °C:7.31 g·cm−3
Liquid State:7.02g·cm−3
at 20 °C:7.365 g·cm−3
Liquid State:6.99g·cm−3
at 20 °C:6.44 g/cm3
1.81 1.78 1.96 N/A
To Learn more about Gallium Indium Tin alloy(Galinstan) please see the below link
Wikipedia - Galinstan - Galinstan
Alibaba - Galinstan
Wikipedia - Gallium

Galinstan is used in the following applications. Thermometer filling, a replacement for toxic Mercury, lubricant, reflection agent and electroconductive medium. Electronic equipment e.g. high power solid laser and radiator (GaInSn plays a new coolant). Used as thermal interface for computer hardware cooling solutions since its excellent Thermal and Electrical Conductivity. Alloy systems that are liquid at room temperature have a high degree of thermal conductivity far superior to ordinary nonmetallic liquids. This results in the use of these materials for specific heat conducting and/or dissipation applications. Other advantages of these liquid alloy systems are their inherent high densities and electrical conductivities.

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