The latest application of low melting point alloys - Thermal Interface Materials

The low melting point alloy series generally contains Bi, Pb, Sn, Cd, In, Ga, Zn, Sb, and other low melting point alloys, also known as "fusible alloys". It is generally believed that their melting points are all below 310°. According to the characteristics of its melting point, it can be divided into two categories: one is called eutectic alloy, and the other is non-eutectic alloy. The melting point of all low melting point alloys is lower than the melting point of any of the pure metals of the alloys formed. The melting point of the eutectic alloy is stable. The melting point (flow temperature) of the non-eutectic alloy varies depending on the test method, the quality of the alloy, the measurement position, the heating rate, and other factors.

The thermal interface material is a general term for materials used for coating between the heat sink member and the heat-generating device to reduce the thermal resistance between them. Everything will have roughness on the surface, so when the two surfaces are in contact, it is impossible to completely touch together. There will always be some air gaps in it, and the thermal conductivity of air is very small, so it is relatively large. Contact thermal resistance. The thermal interface material can be used to fill the air gap, which can reduce the contact thermal resistance and improve the heat dissipation performance.

Filling these gaps with a thermal interface material with high thermal conductivity, eliminating the air therein, establishing an effective heat conduction path between the electronic component and the heat sink, can greatly reduce the thermal resistance, and the effect of the heat sink can be fully exerted.

Thermal interface materials have the following characteristics:

(1) High thermal conductivity;

(2) High flexibility, ensuring that the material can fill the gap of the contact surface most fully under the condition of low installation pressure, and the contact thermal resistance between the thermal interface material and the contact surface is small;

(3) Insulation;

(4) Easy to install and detachable;

(5) Wide applicability, can be used to fill small gaps, but also to fill large gaps.

Product recommendation：Low Melting Point Alloys

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